Máy kiểm tra Nordson DAGE Quadra W8 X Ray
Quadra W8 is a versatile, lab based solution for wafer level inspection offering industry leading magnification and image quality.
- Check shape, fill level and voiding in TSV through silicon vias.
- Inspect build quality, wire bonds, component alignment and solder & adhesive voiding during MEMS manufacture.
- Check for bump presence, shape, position and voiding in wafer bumps.
- Find defects such as cold joints, head in pillow and misalignment in 2.5D and 3D wafer level packages.
Integrated wafer handling ensures operators can inspect wafer level quality directly from the FOUP without needing to handle the wafer.
See the finest details
Quadra™ W8 creates unbeatable images making it easy to see even the tiniest details and find defects quickly.
- Integrated image chain reveals defects as small as 0.1µm. Tube, power supply and detector are all designed and manufactured in house for electronics applications
- Advanced enhancement filters bring out the sharpest images
- Unbeatable resolution with the Aspire 6.7 MP detector