- Can test and evaluate solder paste, PC board and parts-lead.
- All wetting process can be observed from glass windows.
-"Wetting Balance Measuring Method","Micro-Wetting Balance Measuring Method", and "Quick Heating Method" are possible optionally.
- Can simulate reflow oven profile with hot air and N2 purge.
- Electro-balance sensor adopted allows detection of very small force.The wettability of microchips can now be examined by this unit.
- Analyze wetting time and force with exclusive software.
- Solder wire testing is also available.
SP-2 is wettability testing machine for solder paste, parts electrode and PC board, adopted SP-Tension-Method （Temperature Profile Method)